How do robustness and reliability differ?

Reliability & robustness

Task

As in many areas of technology, the goal of power electronics is to make components smaller, lighter and at the same time more powerful. 3-dimensional circuit carriers such as MIDs (Molded Interconnect Devices) have many advantages in this regard. On the one hand, they have the potential for further system miniaturization and functional integration. On the other hand, the number of parts in a system can be reduced and the heat dissipation optimized individually. In addition to MID based on thermoplastics, there have recently also been thermoset and ceramic substrate materials that have been developed and are of interest for power electronics. With smaller power modules and higher power density, however, the demands on the assembly and connection technology (AVT) increase at the same time. An important criterion for the choice of material and the AVT is the thermal performance. The calculation of the transient temperature behavior of the semiconductors for a given power loss profile can be determined, for example, using Zth curves.

Within the scope of this work, WBG power semiconductors are to be measured transiently thermally on novel spatial substrates. Part of the work is the conception, design, construction and construction of test specimens with modern AVT technologies such as soldering, silver-sintering or semi-sintering.

The student work is carried out in cooperation between Hahn-Schickard and the ILH supervised.

Individual activities

  • Construction of test specimens
  • Carrying out Zth examinations
  • Evaluation and summary of the results
  • Documentation of the work

Start: from now on

Contact ILH: Dominik Koch

Contact Hahn-Schickard: Kai Werum

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